Board Design Services
- Product conceptualization and component selection
- High-level architecture & data-path synthesis
- Schematic design
- Energy-efficient, low-power software/firmware development
- Simulation & testing: DFI (Design For Interoperability), EMI, QoS
- PCB design: Component library generation, layout, routing, DFM/DFA
- Shelf management: Power, cooling & interconnect resources
China Vendor Sourcing
- CVL (Certified Vendor List) & CML (Certified Manufacturer List) BOM sourcing
Prototype Development
- PCB prototyping
- PCB testing, including ATE, NDT, ICT (In-Circuit Testing)/BIST, Boundary Scanning
FPGA Design Services
- EDA
- Xilinx, Altera chips
- Programming, pin assignment, board design and implementation
- ATE
Mechanical Packaging
- Design, prototyping & testing
- Reliability engineering
- ESD & EMC compliance & requirements design
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Thermal Management
- Design, prototyping & testing
- Simulation: Velocity, temperature, air flow
- CFD using Flowtherm and IcePak software packages
Data Transport Interfaces
- Flexible design to support many fabric technologies & topologies, with no single point of failure for all system interconnects (Carrier Grade)
Programming
Expertise
- EDA: OrCad, Allegro, Verilog, Valo; VHDL
- Thermal: Flotherm, IcePak
- Strategic technology partnerships: Intel, AMD, Tyco, Phoenix
- Prototype/R&D manufacturing management
- R&D facilities within Tsinghua University: Thermal Physics Lab, FEA & CFD Lab, EE Lab,
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